“Taiwan's PCB Boom: 2025 Output Set to Hit NT$915.7B, Growing Over 12%!”

The Taiwan Printed Circuit Association (TPCA) forecasts that Taiwanese PCB manufacturers will achieve a total output of NT$915.7 billion in 2025, up 12.1% year-on-year, fueled by sustained demand from AI applications.

Strong growth in Q2 2025 was driven by AI server deployments, early procurement due to tariffs, and emerging markets such as satellite communications. PCB output reached NT$218.2 billion, up 14.4% from the same period last year, with first-half output totaling NT$423.6 billion, a 13.8% increase.

High-End Products Lead Growth

• Substrates (BT/ABF): +20.6% YoY, boosted by memory, smartphone, and AI chip demand

• HDI Boards: +16.2% YoY, supported by AI servers, satellite, and PC markets

• Multilayer Boards: +19.2% YoY

• Flexible & Rigid-Flex Boards: +4.1% and +4.7% YoY

  
  

Automotive PCBs were the only segment showing a decline due to high U.S. import tariffs and reduced EV subsidies in Western markets.

Materials & Equipment Taiwan's PCB material output reached NT$195.9 billion (+6.8% YoY), led by high-frequency copper-clad laminates for AI servers. Equipment output grew 33.4% YoY to NT$36.06 billion, driven by Southeast Asia factory expansions and AI server PCB processes.

Supply Chain & Outlook AI server demand is pushing high-end PCB growth but also exposing material bottlenecks, particularly for high-performance glass fiber and HVLP copper foil. TPCA is strengthening the high-end materials supply chain to support Taiwan's continued role in the global high-end PCB market.

Looking ahead, full-year growth is expected to remain robust, with AI servers continuing as the main driver. Key risks include tariffs, exchange rate fluctuations, and market uncertainties, but demand from AI, high-performance computing, satellite communications, and automotive electronics provides a strong foundation.

TPCA Show & IMPACT 2025 The TPCA Show (Oct 22–24) and IMPACT Conference (Oct 21) will showcase Taiwan's PCB and substrate innovations, with speakers from TSMC, AWS, Intel, Sony, and other industry leaders. This year's theme, “Energy-Efficient AI: From Cloud to the Edge,” highlights Taiwan's resilient and high-value PCB industry.

Source of Information: Money Udn