SEMICON Taiwan Showcases the World's Strongest AI Ally — The Strength of Taiwan's Semiconductor Cluster

Focusing on Key Semiconductor Technologies: Advanced Packaging Technology Becomes the Center of Attention

Taiwan holds a leading position globally in semiconductor processes and packaging technologies, boasting numerous world-class wafer foundries, assembly and testing plants, and the most comprehensive semiconductor cluster in the world. This also drives the technological development of surrounding industries. SEMICON Taiwan 2024, scheduled to be held from September 4 to September 6 this year, will feature special zones dedicated to the industry's most focused areas: heterogeneous integration and materials. Companies such as Entegris, GlobalWafers, Samsung Electronics, and SK hynix have been invited to share and discuss advanced semiconductor packaging and materials technologies at the Heterogeneous Integration Forum and the Strategic Materials Summit. This year, SEMICON Taiwan continues to enhance the competitiveness of the semiconductor supply chain by facilitating technology spillovers, constructing a comprehensive AI semiconductor ecosystem, and promoting overall progress and prosperity in both Taiwan and the global industry.

SEMICON Taiwan Showcases Highlights in Advanced Packaging and Materials Technologies, Driving Industry Innovation

As semiconductor technology continues to evolve, new advancements are becoming increasingly complex and challenging. Thus, strategic planning for forward-looking technologies and expanding supply chain cooperation have become even more critical. The ongoing evolution of advanced materials accelerates the performance and efficiency of semiconductor devices, making it a key technology driving advanced processes. Concurrently, advanced packaging technology is progressing towards heterogeneous integration and 3D system-in-package solutions. This year, SEMICON Taiwan's Heterogeneous Integration Pavilion brings together upstream, midstream, and downstream industry leaders, including those in IC design, manufacturing, packaging, and end-system applications, to showcase emerging technologies and applications, painting a comprehensive blueprint for the future of semiconductors.

Additionally, the event will kick off with a four-day Heterogeneous Integration Forum, featuring a strong lineup of speakers from leading companies such as AMD, Micron, Intel, Microsoft, Samsung Electronics, SK hynix, and TSMC. They will share breakthroughs and innovations in heterogeneous integration technologies and products, including HBM, chiplet, and FOPLP, demonstrating the latest developments in key forward-looking technologies.

With the surge in AI demand, the Panel-Level Fan-Out Packaging (FOPLP) Forum has been added for the first time, showcasing the latest advancements in technology.

With the explosive demand for AI, the capacity for advanced packaging technologies required for AI chips is becoming tight. Panel-Level Fan-Out Packaging (FOPLP) uses rectangular substrates for IC packaging, achieving higher utilization within the same unit area. This has made FOPLP one of the most popular and closely watched next-generation technologies in recent heterogeneous integration advanced packaging. However, challenges such as panel warping, uniformity, and yield rates need to be overcome. In response, this year's SEMICON Taiwan International Semiconductor Exhibition has added the Panel-Level Fan-Out Packaging Innovation Forum to the Heterogeneous Integration series for the first time. The forum will feature industry leaders such as ASE, Innolux, and NXP to discuss the latest technological developments. This initiative aims to accelerate technological breakthroughs and early deployment, significantly enhancing semiconductor manufacturing capabilities.

Industry Spillover Effects, Driving Mutual Prosperity

In addition to packaging technology, mechanical equipment is also a crucial part of the peripheral supply chain for the semiconductor industry. Taiwan's advancements in semiconductor technology have simultaneously driven the development of the mechanical industry. This year's SEMICON Taiwan International Semiconductor Exhibition will feature a Precision Machinery Pavilion and will host the participation of the Taiwan Machine Tool & Accessory Builders' Association (TMBA) Smart Team. Their involvement aims to bolster the development of semiconductor equipment in Taiwan and propel it onto the international stage.