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部落格摘要


“From Chips to Power: Why the Next AI Race Is All About Electricity”
The turning point in the global AI race has officially shifted from chip supply timelines to power and grid infrastructure. As electricity demand from hyperscale data centers surges exponentially, power has not only become the core of hundreds of billions of dollars in capital expenditure for tech giants like Microsoft and Amazon, but is also emerging as a national security concern in the United States due to severe shortages of critical equipment such as transformers and ris
Jun 242 min read


“Largan's CPO Reality Check: 2 Million Units a Month… but Where Do 40,000 Workers Come From?”
The world's leading smartphone lens maker, Largan Precision, made its debut at Computex—not for mobile camera lenses, but to showcase one of the hottest topics in AI data centers: Co-Packaged Optics (CPO). The appearance was low-key. Largan secured a last-minute mini booth to present its early technological progress in optical communication components. What truly caught attention, however, was not the exhibit itself, but a number revealed by an executive on-site: If current s
Jun 243 min read


“TSMC Charts the Future of AI: A Trillion-Dollar Silicon Economy Driven by A13 and Wafer-Scale Packaging”
At TSMC's 2026 Technology Symposium, the most striking opening message was not merely about process node scaling, but a bold outlook on the broader market: driven by advanced semiconductor technologies, the industry is now expected to reach the long-anticipated US$1 trillion milestone—originally projected for 2030—as early as this year. As artificial intelligence rapidly evolves from generative AI to agentic AI and further into physical AI, the technology landscape is undergo
May 225 min read


“From Chips to Drones: 11 Startups Accelerate Robotics and Data Center Innovation in IC Taiwan Challenge”
The National Science and Technology Council (NSTC) has announced the winners of the 4th batch of the IC Taiwan Grand Challenge (ICTGC). A total of 11 startups from the United States, the United Kingdom, France, Germany, Japan, Israel, and Taiwan were selected this round. Their expertise spans across chip design verification, IP development, key components, data center infrastructure, as well as specialized intelligent applications in areas such as smart buildings and autonomo
May 223 min read
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